JPH0416457Y2 - - Google Patents

Info

Publication number
JPH0416457Y2
JPH0416457Y2 JP1985178065U JP17806585U JPH0416457Y2 JP H0416457 Y2 JPH0416457 Y2 JP H0416457Y2 JP 1985178065 U JP1985178065 U JP 1985178065U JP 17806585 U JP17806585 U JP 17806585U JP H0416457 Y2 JPH0416457 Y2 JP H0416457Y2
Authority
JP
Japan
Prior art keywords
comb
mounting
light emitting
shaped conductive
conductive pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1985178065U
Other languages
English (en)
Japanese (ja)
Other versions
JPS6287465U (en]
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985178065U priority Critical patent/JPH0416457Y2/ja
Publication of JPS6287465U publication Critical patent/JPS6287465U/ja
Application granted granted Critical
Publication of JPH0416457Y2 publication Critical patent/JPH0416457Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Structure Of Printed Boards (AREA)
JP1985178065U 1985-11-19 1985-11-19 Expired JPH0416457Y2 (en])

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1985178065U JPH0416457Y2 (en]) 1985-11-19 1985-11-19

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985178065U JPH0416457Y2 (en]) 1985-11-19 1985-11-19

Publications (2)

Publication Number Publication Date
JPS6287465U JPS6287465U (en]) 1987-06-04
JPH0416457Y2 true JPH0416457Y2 (en]) 1992-04-13

Family

ID=31119849

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985178065U Expired JPH0416457Y2 (en]) 1985-11-19 1985-11-19

Country Status (1)

Country Link
JP (1) JPH0416457Y2 (en])

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5128881B2 (ja) * 2007-08-31 2013-01-23 パナソニック株式会社 実装用基板及び発光モジュール
CN104900638B (zh) * 2015-05-27 2017-10-24 深圳市华星光电技术有限公司 发光元件组装结构

Also Published As

Publication number Publication date
JPS6287465U (en]) 1987-06-04

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